2. 2D or 3D, that’s the simulation question for EMC!

Andy Degraeve (IEEE Member) was born in Ghent, Belgium, on June 6, 1980.

He received the M.S. degree in electronics and computer engineering from the KU Leuven, Technology Campus Ostend, Belgium, in 2014.

In June 2014 he received a nomination for the best master thesis, by the ‘ie-net’ engineering association. From 2014 till 2018, he was a Research Assistant at the KU Leuven Campus Bruges, Research group ReMI, Reliability in Mechatronics & ICT (now called “M-Group” standing for “Mechatronics Group”). His main research interests included electromagnetic compatibility, immunity and functional safety in life or mission critical situations.

In May 2018 he was a Technical Session chair at the joint IEEE EMC and APEMC symposium in Singapore, Singapore. From 2019 till 2020 he was the Technical and Product Manager at Schlegel Electronic Materials, a member of eMei group, in Belgium, with a focus on shielding, absorbing and thermal management materials.

From 2020, he is focussing on EMC education and diagnostics using low-cost test equipment, and joined Cherry Clough Consultants Ltd as an Associate to provide independent expertise in good, cost-effective EMC design, worldwide.